Attendees at Mobile World Congress will be able to view the LTE UE demonstration in both CEVA's and mimoOn's booths, located at 1G45 in Hall 1 and 2B17 in Hall 2, respectively.
Previously, in 2009, mimoOn and CEVA announced a partnership to offer software-based, 3GPP compliant, integrated UE solutions for LTE wireless basebands resulting in a DSP optimized LTE UE implementation in a short period of time. This highlights the modularity and portability of mimoOn's software, as well as CEVA-XC's advanced processing capabilities and ease of programming using CEVA LTE libraries and CEVA-Toolbox™ SW development environment.
"With the build out of LTE networks underway with carriers worldwide, the focus is shifting towards the user equipment," stated Thomas Kaiser, CEO of mimoOn. "Our mi!MobilePHY™ LTE software implementation on CEVA's flexible and fully programmable processor technology speeds time-to-market for our mutual customers developing the next generation of mobile broadband devices."
"This fully integrated, end-to-end LTE demonstration with mimoOn represents a significant milestone for our CEVA-XC processor," said Gideon Wertheizer, CEO of CEVA. "The demonstration platform clearly illustrates the benefits of working with CEVA and mimoOn for the rapid development of software-based, standards-compliant LTE UE solutions."
mi!MobilePHY™ is a full-featured and certified LTE software solution for user equipment (handsets) that supports mandatory and optional features in the 3GPP Release 8 standard. mimoOn's software is modular and written in ANSI-C language, which allows flexibility and scalability, with advanced algorithms such as advanced MIMO detectors. mi!MobilePHY™ is written for low memory and power consumption.
The CEVA-XC is a high-performance, low-power configurable DSP designed specifically for 4G mobile handsets and wireless infrastructure. Even in its minimum configuration, a single CEVA-XC core can handle a complete 4G transceiver path in software. This single-core architecture eliminates the need for heterogeneous designs with multiple coprocessors, accelerators, or SIMD engines—and thus reduces time-to-market and software design complexity.
As a fully programmable solution, the CEVA-XC supports multiple air interfaces in software, including LTE, WiMAX, HSPA+, and 3G. CEVA's highly innovative power scaling unit (PSU) approach makes CEVA-XC up to four times more power efficient than general purpose DSPs, addressing the strict power constraints of battery operated devices.
About mimoOn
mimoOn GmbH is the LTE pioneer in end-to-end software implementation and system design on SDR platforms. The company's scalable and modular 3GPP LTE infrastructure software families "mi!Femto™ & mi!Pico™" and terminal software family "mi!Mobile™" allows equipment manufacturers to fully exploit the numerous benefits of SDR. mimoOn's pre-certified Physical Layer (PHY) and Protocol Stack (MAC, PDCP, RLC, and RRC) software packages assure fast time to market, conformance to the latest release of the standards, ease of integration, and design to the lowest BoM. Thanks to SDR, mimoOn's LTE hardware product "mi!TestMOBILE™" delivers an affordable, highly flexible, portable test device enabling a reduction in CAPEX and OPEX for OEMs & network operators.
Due to the team's strong background from tier 1 mobile phone manufacturers and the company's ongoing research at leading-edge academic institutions, mimoOn is able to provide highly innovative solutions to the cellular industry. The company has been voted into EE Times annual list of Emerging Startups and also listed as one of Germany's most promising High-Tech companies. Visit www.mimoOn.de.
About CEVA
CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, including handsets from all top five handset OEMs – Nokia, Samsung, LG, Motorola and Sony Ericsson. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com
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