3D Circuit to ramp up handset-use antenna modules Tweet

Taiwan-based 3D Circuit is ramping up its output of handset-use antenna modules, made with its in-house developed 3D LDS (laser direct structuring) process, to 4.2 million units in June from 3.3 million units currently, according to the company.

The company's antenna modules, featuring 3D circuit designs, have been adopted by branded handset vendors, including Nokia, Motorola and RIM (Research in Motion), said company president Chen Hui-Hsiung. In addition, 3D Circuit is now also waiting for the verification of the product from a smartphone vendor, Chen added.

For the projected capacity ramp, the company plans to increase the number of its LDS equipment at its plant in Kunshan, China from the current seven sets to 10-11 in June, Chen noted, adding the company currently is also operating four sets of LDS equipment in Taiwan.

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