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Tripod and Unimicron to benefit from any-layer HDI board shipments for iPhone 4G

Thursday, May 20, 2010

PCB makers Tripod Technology and Unimicron Technology are expected to see their profits increase significantly in the second half of 2010 buoyed by shipments of any-layer HDI boards for Apple's iPhone 4G handsets, according to industry sources.

The ASP (average selling price) of any-layer HDI boards is nearly twice as much as that of traditional HDI boards, the sources explained. Tripod and Unimicron both declined to comment on the sources' claims.

According to an estimate of industry sources, shipments of iPhone 4G handsets will total 3.5-4 million units in second-quarter 2010 before climbing to 8.5-9 million units in the third quarter. All shipments of iPhone 4G handsets will be built with any-layer HDI boards, the sources indicated.



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